Display device including connection wiring part laterally adjacent to driving voltage wiring

ABSTRACT

A display device includes a base layer including an active area and a peripheral area outside the active area, a circuit element layer including a pixel circuit in the active area and a driving voltage wiring located in the peripheral area to supply a driving voltage to the pixel circuit. A light emitting element layer including a plurality of light emitting elements on the circuit element layer, a thin film sealing layer to cover the light emitting element layer, and an input sensing layer on the thin film sealing layer and including a sensing electrode and a sensing signal wiring part connected to the sensing electrode. The circuit element layer includes a connection wiring part overlapping the driving voltage wiring in the peripheral area and contacts the sensing signal wiring part. The connection wiring part is at a different layer from the driving voltage wiring.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/903,867, filed Jun. 17, 2020, which claims priority to and thebenefit of Korean Patent Application No. 10-2019-0078941, filed Jul. 1,2019, the entire content of both of which is incorporated herein byreference.

BACKGROUND

The present disclosure herein relates to a display device, and moreparticularly, to a display device with relatively high sensitivity(e.g., improved sensing sensitivity).

An electronic device is activated in response to an electrical signal.An electronic device may include multiple devices composed of variouselectronic components, such as a display unit for displaying an image,or an input detection unit for detecting an external input. Electroniccomponents may be electrically interconnected by variously arrangedsignal lines.

There may be various different numbers of signal lines depending on thenumber of electronic components or the processing environment. Thesignal lines may be designed to be arranged with a proper spacingtherebetween to prevent or reduce electrical signal interference withina set or predetermined panel area. The signal lines may receiveelectrical signals applied from the outside through pads (e.g.,electrical pads). As the processing speed or the amount of processingdata of the electronic device increases, a larger number of signal linesand the pads may be desired. Accordingly, mutual interference betweenelectronic components or signal lines may increase.

SUMMARY

The present disclosure is to provide a display device with relativelyhigh sensitivity (e.g., improved sensing sensitivity) of an electronicmodule.

An embodiment of the present disclosure provides a display deviceincluding: a base layer including an active area and a peripheral arealocated outside the active area; a circuit element layer including apixel circuit located in the active area of the base layer and a drivingvoltage wiring located in the peripheral area of the base layer tosupply a driving voltage to the pixel circuit; a light emitting elementlayer including a plurality of light emitting elements on the circuitelement layer; a thin film sealing layer configured to cover the lightemitting element layer; and an input sensing layer located on the thinfilm sealing layer and including a sensing electrode and a sensingsignal wiring part connected to the sensing electrode.

The circuit element layer includes a connection wiring part overlappingthe driving voltage wiring in the peripheral area on a plane andconfigured to contact the sensing signal wiring part.

The connection wiring part is located on a different layer from thedriving voltage wiring.

In some embodiments, the sensing electrode includes a first sensingelectrode; and a second sensing electrode electrically insulated fromthe first sensing electrode to form a capacitance. In some embodiments,the sensing signal wiring part includes a reception wiring partconnected to the first sensing electrode; and a transmission wiring partconnected to the second sensing electrode. In some embodiments, theconnection wiring part contacts the reception wiring part or thetransmission wiring part.

In some embodiments, the transmission wiring part includes a firsttransmission wiring part connected to one end of the second sensingelectrode; and a second transmission wiring part connected to the otherend of the second sensing electrode. In some embodiments, the connectionwiring part contacts the second transmission wiring part.

In some embodiments, the second transmission wiring part includes aplurality of other side transmission wirings connected to the other endof the second sensing electrode; a first sensing contact part located atone end of the plurality of other side transmission wirings; and asecond sensing contact part located at the other end of the plurality ofother side transmission wirings. In some embodiments, the connectionwiring part includes a plurality of sensing connection wirings extendingalong the plurality of other side transmission wirings; a first contactpart connected to one end of the plurality of sensing connection wiringsto face the first sensing contact part; and a second contact partconnected to the other end of the plurality of sensing connectionwirings to face the second sensing contact part.

In some embodiments, the plurality of sensing connection wirings isoverlapping the driving voltage wiring. In some embodiments, the firstsensing contact part directly contacts the first contact part, and thesecond sensing contact part directly contacts the second contact part.In some embodiments, each of the plurality of other side transmissionwirings includes a first wiring layer on the thin film sealing layer;and a second wiring layer located adjacent to the first wiring layerwith a touch insulating layer interposed therebetween. In someembodiments, the first wiring layer and the second wiring layer areelectrically connected to each other. In some embodiments, each of theplurality of other side transmission wirings includes one of the firstwiring layer and the second wiring layer in a crossing area where theplurality of sensing connection wirings cross.

In some embodiments, the pixel circuit includes a pixel transistorincludes a control electrode, an output electrode, and an inputelectrode; and a connection electrode on the output electrode. In someembodiments, wherein the light emitting element is electricallyconnected to the connection electrode. In some embodiments, the drivingvoltage wiring is located at the same layer as the connection electrode.In some embodiments, the connection wiring part is located at the samelayer as the input electrode and the output electrode. In someembodiments, the active area includes a non-display area having at leastone hole, and having a display area surrounding the non-display area. Insome embodiments, the pixel circuit and the light emitting element arelocated in the display area.

In an embodiment of the present disclosure, a display device includes: abase layer including an active area and a peripheral area locatedoutside the active area; a circuit element layer including a pixelcircuit located in the active area of the base layer and a drivingvoltage wiring located in the peripheral area of the base layer tosupply a driving voltage to the pixel circuit; a light emitting elementlayer including a plurality of light emitting elements on the circuitelement layer; a thin film sealing layer configured to cover the lightemitting element layer; and an input sensing layer located on the thinfilm sealing layer and including a sensing electrode and a sensingsignal wiring part connected to the sensing electrode.

The circuit element layer includes a connection wiring part located onthe same layer as the driving voltage wiring in the peripheral area on aplane and contacting the sensing signal wiring part.

In some embodiments, the sensing electrode includes a first sensingelectrode; and a second sensing electrode electrically insulated fromthe first sensing electrode to form a capacitance. In some embodiments,the sensing signal wiring part includes a reception wiring partconnected to the first sensing electrode; and a transmission wiring partconnected to the second sensing electrode, wherein the connection wiringpart contacts the reception wiring part or the transmission wiring part.

In some embodiments, the transmission wiring part includes a firsttransmission wiring part connected to one end of the second sensingelectrode; and a second transmission wiring part connected to the otherend of the second sensing electrode. In some embodiments, the connectionwiring part contacts the second transmission wiring part. In someembodiments, the second transmission wiring part includes a plurality ofother side transmission wirings connected to the other end of the secondsensing electrode; a first sensing contact part located at one end ofthe plurality of other side transmission wirings; and a second sensingcontact part located at the other end of the plurality of other sidetransmission wirings.

In some embodiments, the connection wiring part includes a plurality ofsensing connection wirings extending along the plurality of other sidetransmission wirings; a first contact part connected to one end of theplurality of sensing connection wirings to face the first sensingcontact part; and a second contact part connected to the other end ofthe plurality of sensing connection wirings to face the second sensingcontact part. In some embodiments, the pixel circuit includes a pixeltransistor including a control electrode, an output electrode, and aninput electrode. In some embodiments, the light emitting element iselectrically connected to the output electrode. In some embodiments, thedriving voltage wiring and the plurality of other side transmissionwirings are located at the same layer as the input and outputelectrodes.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings are included to provide a furtherunderstanding of the present disclosure, and are incorporated in andconstitute a part of this specification. The drawings illustrateembodiments of the present disclosure and, together with thedescription, serve to explain principles of the present disclosure. Inthe drawings:

FIG. 1A is a perspective view of a display device according to anembodiment of the present disclosure;

FIG. 1B is an exploded perspective view of a display device according toan embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating a display device according to anembodiment of the present disclosure;

FIG. 3A is a plan view of a display panel according to an embodiment ofthe present disclosure;

FIG. 3B is an equivalent circuit diagram of a pixel according to anembodiment of the present disclosure;

FIG. 4 is a cross-sectional view of a display panel shown in FIG. 3 ;

FIG. 5 is a plan view of an input sensing unit according to anembodiment of the present disclosure;

FIG. 6 is an enlarged plan view of an area A1 shown in FIG. 5 ;

FIG. 7 is a cross-sectional view taken along the line I-I′ shown in FIG.6 ;

FIG. 8 is a cross-sectional view taken along the line II-II′ shown inFIG. 6 ;

FIG. 9 is a cross-sectional view taken along the line III-III′ shown inFIG. 6 .

FIG. 10 is a plan view of a display device according to an embodiment ofthe present disclosure.

FIG. 11 is a plan view of an input sensing unit according to anembodiment of the present disclosure;

FIG. 12 is an enlarged plan view of an area A2 shown in FIG. 11 ; and

FIG. 13 is a cross-sectional view taken along the line IV-IV′ shown inFIG. 12 .

DETAILED DESCRIPTION

In this specification, when it is mentioned that a component (or, anarea, a layer, a part, etc.) is referred to as being “on”, “connectedto” or “combined to” another component, this means that the componentmay be directly on, connected to, or combined to the other component ora third component therebetween may be present.

Like reference numerals refer to like elements. Additionally, in thedrawings, the thicknesses, proportions, and dimensions of components areexaggerated for effective description.

“And/or” includes all of one or more combinations defined by relatedcomponents.

It will be understood that the terms “first” and “second” are usedherein to describe various components but these components should not belimited by these terms. The above terms are used only to distinguish onecomponent from another. For example, a first component may be referredto as a second component and vice versa without departing from the scopeof the present disclosure. The singular expressions include pluralexpressions unless the context clearly dictates otherwise.

In addition, terms such as “below”, “the lower side”, “on”, and “theupper side” are used to describe a relationship of configurations shownin the drawing. The terms are described as a relative concept based on adirection shown in the drawing.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as terms commonly understood bythose skilled in the art to which this invention belongs. In general,the terms defined in the dictionary should be considered to have thesame meaning as the contextual meaning of the related art, and, unlessclearly defined herein, should not be understood abnormally or as havingan excessively formal meaning.

In various embodiments of the present disclosure, the term “include,”“comprise,” “including,” or “comprising,” specifies a property, aregion, a fixed number, a step, a process, an element and/or a componentbut does not exclude other properties, regions, fixed numbers, steps,processes, elements and/or components.

Hereinafter, another embodiment of the present disclosure will bedescribed with reference to the drawings.

FIG. 1A is a perspective view of a display device according to anembodiment of the present disclosure. FIG. 1B is an exploded perspectiveview of a display device according to an embodiment of the presentdisclosure. FIG. 2 is a block diagram illustrating a display deviceaccording to an embodiment of the present disclosure. Hereinafter, thepresent disclosure will be described with reference to FIGS. 1A-2 .

Referring to FIGS. 1A-2 , a display device EA according to an embodimentof the present disclosure may be a device activated according to anelectrical signal. The display device EA may include variousembodiments. For example, the display device EA may include a tablet, anotebook, a computer, a television, and the like. In this embodiment,the display device EA is shown as a smart phone, for example.

The display device EA may display an image IM toward the third directionDR3 on the display surface FS parallel to the first direction DR1 andthe second direction DR2. For example, the image IM is displayed on aplane expanded along the first direction DR1 and the second directionDR2. The display surface FS on which the image IM is displayed maycorrespond to the front surface of the display device EA and maycorrespond to the front surface FS of the window 100. Hereinafter, thesame reference numeral FS will be used for the display surface and thefront surface of the display device EA, and the front surface of thewindow 100. The image IM may include still images as well as dynamicimages (e.g., moving images, e.g., video). In FIG. 1A, a watch windowand application icons are shown as an example of the image IM.

In the present embodiment, the front surface (or upper surface) and therear surface (or lower surface) of each member are defined withreference to the direction in which the image IM is displayed. Forexample, the front surface and the rear surface of each member of thedisplay device are defined with respect to the third direction DR3. Forexample, the front surface and the rear surface are opposite to eachother in the third direction DR3, and the normal direction of each ofthe front surface and the rear surface may be parallel to the thirddirection DR3. Moreover, the directions that the first to thirddirections DR1, DR2, and DR3 indicate may be converted to otherdirections as a relative concept.

Referring to FIG. 1B, the display device EA may include a window 100, adisplay module 200, a driving circuit unit 300, a housing 400, andelectronic modules 500. In the present embodiment, the window 100 andthe housing 400 may be combined to form an appearance of the displaydevice EA. For example, the window 100 and the housing 400 are thecomponents (or members) of the display device EA, which enclose othercomponents of the display device EA, as illustrated in FIG. 1A.

The window 100 may include an optically transparent insulating material.For example, the window 100 may include glass or plastic. The window 100may have a multi-layer structure or a single-layer structure. Forexample, the window 100 may include a plurality of plastic films bondedtogether with an adhesive, or may include a glass substrate and aplastic film bonded together with an adhesive.

The window 100 may be divided into a transmission area TA and a bezelarea BZA on a plane (e.g., a plan view). In this specification, themeaning of “being on a plane” or “in a plan view” means that it isviewed in the third direction DR3. In addition, “the thicknessdirection” may mean the third direction DR3.

The transmission area TA may be an optically transparent area. The bezelarea BZA may be an area with a lower light transmittance compared to thetransmission area TA. The bezel area BZA may define the shape of thetransmission area TA. The bezel area BZA is adjacent to the transmissionarea TA and may surround the transmission area TA.

The bezel area BZA may have a set or predetermined color. The bezel areaBZA covers the peripheral area NAA of the display module 200 so as toprevent or reduce the peripheral area NAA from being visually recognizedfrom the outside. For example, the bezel area BZA reduces thepossibility of the peripheral area NAA being visible to the user. On theother hand, this is illustrated by way of example, and in the window 100according to an embodiment of the present disclosure, the bezel area BZAmay be omitted.

In an embodiment of the present disclosure, the sensor areas SA1 and SA2may be areas overlapping the electronic modules 500 to be describedlater. The display device EA may receive an external signal for theelectronic modules 500 through the sensor areas SA1 and SA2 or mayprovide a signal outputted from the electronic modules 500 to theoutside. According to embodiments of the present disclosure, the sensorareas SA1 and SA2 may overlap the transmission area TA. Therefore, aseparate area for the sensor areas SA1 and SA2 may be omitted. Thus, thearea of the bezel area BZA may be relatively reduced.

In FIG. 1B, the two sensor areas SA1 and SA2 are illustrated, but thepresent disclosure is not limited thereto. For example, the sensor areasSA1 and SA2 may be defined in three or more, or one of them may beomitted and they may be defined in the singular. In addition, in FIG.1B, the sensor areas SA1 and SA2 are defined at the left upper end ofthe transmission area TA by way of example, but the sensor areas SA1 andSA2 may be located in various areas such as the right upper end of thetransmission area TA, the center of the transmission area TA, the leftlower end of the transmission area TA, or the right lower end of thetransmission area TA. In addition, one sensor area SA1 may be defined atthe left upper end of the transmission area TA, and the other sensorarea SA2 may be defined at the right upper end of the transmission areaTA.

The display module 200 may be located under the window 100. In thisspecification, “below” may refer to a direction opposite to a directionin which the display module 200 displays an image. For example, in oneembodiment, “below” may refer to a direction opposite to the thirddirection DR3. The display module 200 may display an image IM and detectan external input TC. The display module 200 includes a front surface ISincluding an active area AA and a peripheral area NAA. The active areaAA may be an area activated according to an electrical signal. Forexample, the active area AA may turn on in response to receiving anelectrical signal.

In the present embodiment, the active area AA is an area where the imageIM is displayed, and at the same time, an area where the external inputTC is detected. The transmission area TA may at least overlap the activearea AA. For example, the transmission area TA overlaps the frontsurface or at least a portion of the active area AA. Accordingly, theuser may view the image IM through the transmission area TA and/orprovide an external input TC.

The peripheral area NAA may be an area covered by the bezel area BZA.The peripheral area NAA is adjacent to the active area AA. Theperipheral area NAA may surround the active area AA. A driving circuitor driving wiring for driving the active area AA may be located in theperipheral area NAA.

In this embodiment, the display module 200 is assembled in a flat statein which the active area AA and the peripheral area NAA face the window100. However, this is illustratively shown, and a portion of theperipheral area NAA may be bent. In some embodiments, a portion of theperipheral area NAA faces the rear surface of the display device EA, sothat the area of the bezel area BZA on the front surface of the displaydevice EA may be relatively reduced. Alternatively, the display module200 may be assembled in a state in which a portion of the active area AAis also bent. Alternatively, in the display module 200 according to anembodiment of the present disclosure, the peripheral area NAA may beomitted.

The display module 200 may include a display panel 210 and an inputsensing unit 220.

The display panel 210 may generate an image IM. The image IM generatedby the display panel 210 is displayed on the front surface IS and isvisually recognized by the user through the transmission area TA.

The input sensing unit 220 detects an external input TC applied from theoutside. For example, the input sensing unit 220 may detect an externalinput TC provided to the window 100. The external input TC may be a userinput. The user's inputs include various types of external inputs suchas touch (e.g., by a part of the user's body), light, heat, pen, orpressure. In this embodiment, the external input TC is shown with theuser's hand applied to (or touching) the front surface FS. But, this isillustrated by way of example, and as described above, the externalinput TC may be provided in various forms, and also, according to thestructure of the display device EA, the external input TC applied to theside or rear surface of the display device EA may be detected, and thepresent disclosure is not limited to any one embodiment.

The driving circuit unit 300 may be electrically connected to thedisplay module 200. The driving circuit unit 300 may include a maincircuit board MB and a flexible film CF.

The flexible film CF is electrically connected to the display module200. The flexible film CF may connect the display module 200 and themain circuit board MB. For example, the flexible film CF acts as anelectrical interconnect between the display module 200 and the maincircuit board MB. The flexible film CF may be connected to the pads(e.g., display pads) of the display module 200 located in the peripheralarea NAA. The flexible film CF provides the display module 200 with anelectrical signal for driving the display module 200. For example, thedisplay module 200 receives the driving electrical signal via theflexible film CF. The electrical signal may be generated from theflexible film CF or generated from the main circuit board MB.

The flexible film CF may be electrically connected to the display panel210 and the input sensing unit 220. Therefore, the flexible film CFprovides the display module 200 with an electrical signal for drivingthe display panel 210 and an electrical signal for driving the inputsensing unit 220. The electrical signal may be generated from theflexible film CF or generated from the main circuit board MB.

The main circuit board MB may include various driving circuits fordriving the display module 200, connectors for power supply, and thelike. The flexible film CF may be connected to the main circuit boardMB. According to the present disclosure, one main circuit board MB andone flexible film are connected to the display module 200. However, thisis illustrated by way of example, and in the display module 200according to an embodiment of the present disclosure, the display panel210 and the input sensing unit 220 may be connected to different maincircuit boards and different flexible films.

In one embodiment of the present disclosure, one area of the displaymodule 200 corresponding to the sensor areas SA1 and SA2 may have arelatively higher transmittance than the active area AA that does notoverlap the sensor areas SA1 and SA2. For example, at least some of thecomponents of the display panel 210 and the components of the inputsensing unit 220 may be removed. Therefore, the electronic modules 500located to overlap the sensor areas SA1 and SA2 may transmit and/orreceive a signal through the sensor areas SA1 and SA2.

FIG. 1B illustrates that set or predetermined holes MH1 and MH2 (e.g.,hereinafter referred to as module holes) are defined in one areas of thedisplay module 200 corresponding to the sensor areas SA1 and SA2. Themodule holes MH1 and MH2 may be defined in the active area AA andpenetrate the display module 200. The display panel 210 and the inputsensing unit 220 may be penetrated by the module holes MH1 and MH2. Thatis, the module holes MH1 and MH2 may be defined by removing all of theconfigurations of the display panel 210 and the configurations of theinput sensing unit 220, which overlap with the sensor areas SA1 and SA2.The module holes MH1 and MH2 are defined in the active area AA, so thatthe sensor areas SA1 and SA2 may be located in the transmission area TA.

The electronic modules 500 may include a first electronic module 501 anda second electronic module 502. On a plane (for example, in a plan viewof a plane expanded along the first direction DR1 and the seconddirection DR2), the first and second electronic modules 501 and 502 mayoverlap with the module holes MH1 and MH2 and the sensor areas SA1 andSA2. The first and second electronic modules 501 and 502 may be locatedunder the display module 200, and at least a portion of the first andsecond electronic modules 501 and 502 may be received in the moduleholes MH1 and MH2. The first and second electronic modules 501 and 502may receive an external input transmitted through the sensor areas SA1and SA2 or provide an output through the sensor areas SA1 and SA2.

The housing 400 is coupled with the window 100. The housing 400 iscoupled with the window 100 to provide a set or predetermined space(e.g., inner space) to accommodate the display module 200 and theelectronic modules 500 inside the display device EA. The display module200 and the electronic modules 500 may be accommodated in an internalspace.

The housing 400 may include a material having a relatively highstiffness or rigidity. For example, the housing 400 may include aplurality of frames and/or plates including glass, plastic, or metal, ora combination thereof. The housing 400 may provide protection to (e.g.,may stably protect) the components of the display device EA accommodatedin the inner space from external impacts.

As shown in FIG. 2 , the display device EA may include a display module200, a power supply module PM, a first electronic module EM1, and asecond electronic module EM2. The display module 200, the power supplymodule PM, the first electronic module EM1, and the second electronicmodule EM2 may be electrically connected to each other.

The power supply module PM supplies power necessary for the overalloperation of the display device EA. The power supply module PM mayinclude a battery module.

The first electronic module EM1 and the second electronic module EM2 mayinclude various functional modules for operating the display device EA.

The first electronic module EM1 may be on (e.g., directly mounted on) amotherboard electrically connected to the display module 200 or may beon (e.g., mounted on) a separate board and electrically connected to themotherboard through a connector or the like.

The first electronic module EM1 may include a control module CM, awireless communication module TM, an image input module IIM, an audioinput module AIM, a memory MM, and an external interface IF. In someembodiments, of the modules may not be mounted on the motherboard, butmay be electrically connected to the motherboard through a flexiblecircuit board.

The control module CM controls the overall operation of the displaydevice EA. The control module CM may be a microprocessor. For example,the control module CM activates or deactivates the display module 200.The control module CM may control other modules such as the image inputmodule IIM or the audio input module AIM based on the touch signalreceived from the display module 200.

The wireless communication module TM may transmit/receive a wirelesssignal to/from another device (e.g., an external device) terminal usinga Bluetooth or a Wi-Fi connection. The wireless communication module TMmay transmit and/or receive a voice signal using a general communicationline. The wireless communication module TM may include a transmissionunit TM1 for modulating and transmitting a signal to be transmitted, anda reception unit TM2 for demodulating the received signal.

The image input module IIM processes the image signal and converts itinto image data that may be displayed on the display module 200. Theaudio input module AIM receives an external audio signal by a microphonein a recording mode, a voice recognition mode, etc., and converts itinto electrical voice data.

The external interface IF may serve as an interface connected to anexternal charger, a wired and/or wireless data port, and a card socket(e.g., a memory card, a subscriber identification module (SIM) or useridentity module (UIM) card, and the like).

The second electronic module EM2 may include an audio output module AOM,a light emitting module LM, a light receiving module LRM, and a cameramodule CMM. The configurations may be on (e.g., directly mounted on) themotherboard, or on (e.g., mounted on) a separate substrate andelectrically connected to the display module 200 through a connector, orelectrically connected to the first electronic module EM1.

The audio output module AOM converts the audio data received from thewireless communication module TM or the audio data stored in the memoryMM and outputs the converted audio data.

The light emitting module LM generates and outputs light. The lightemitting module LM may output infrared rays. The light emitting moduleLM may include a light emitting diode (LED) element. The light receivingmodule LRM may sense infrared rays. The light receiving module LRM maybe activated when an infrared ray of a set or predetermined level orhigher is sensed. For example, the light receiving module LRM may turnon in response to an infrared ray of a set or predetermined level oflight being applied to (or incident on) the light receiving module LRM.The light receiving module LRM may include a complementarymetal-oxide-semiconductor (CMOS) sensor. After the infrared lightgenerated by the light emitting module LM is outputted, the infraredlight is reflected by an external object (e.g., a user finger or aface), and the reflected infrared light may be incident on the lightreceiving module LRM. The camera module CMM may capture an image of theoutside.

Each of the first and second electronic modules 501 and 502 according toan embodiment of the present disclosure may include at least one of thefirst electronic module EM1 and the second electronic module EM2. Forexample, each of the first and second electronic modules 501 and 502 mayinclude at least one of an audio output module AOM, a light emittingmodule LM, a light receiving module LRM, a camera module CMM, and athermal sensing module. The first and second electronic modules 501 and502 may sense an external input (e.g., signal) received through thesensor areas SA1 and SA2, and/or provide a sound signal such as a voiceor light, such as infrared light, to the outside through the sensorareas SA1 and SA2.

FIG. 3A is a plan view of a display panel according to an embodiment ofthe present disclosure, and FIG. 3B is an equivalent circuit diagram ofone pixel according to an embodiment of the present disclosure. FIG. 4is a cross-sectional view of a display panel shown in FIG. 3A.

Referring to FIG. 3A, the display panel 210 may include a base layer BS,a plurality of pixels PX, a plurality of signal wirings SNL1, SNL2,EVDL, and EVSL, and a plurality of display pads PD1 to PD3.

The active area AA of the display panel 210 is an area where an image isdisplayed and the peripheral area NAA may be an area where a drivingcircuit and corresponding wirings are located. In FIG. 3A, the activearea AA and the peripheral area NAA of the display panel 210 are shown.A plurality of pixels PX may be located in the active area AA.

The base layer BS may be a silicon substrate, a plastic substrate, aglass substrate, an insulating film, or a laminated structure includinga plurality of insulating layers.

The base layer BS may include a first area AR1, a second area AR2, and athird area AR3. The first area and the second area AR1 and AR2 may bedefined to be spaced from each other. When viewed on a plane, the thirdarea AR3 may surround the first and second areas AR1 and AR2. The thirdarea AR3 may be surrounded by the peripheral area NAA. That is, thefirst to third areas AR1 to AR3 may be included in the active area AA.The pixels PX may be located in the third area AR3.

The first and second areas AR1 and AR2 may be areas overlapping thefirst and second sensor areas SA1 and SA2 on a plane, respectively.First and second module holes MH1 and MH2 may be in the first and secondareas AR1 and AR2, respectively. Each of the first and second moduleholes MH1 and MH2 may include a hole penetrating the front and rearsurfaces of the base layer BS.

The first area AR1 is formed with a larger size than the first modulehole MH1, and the second area AR2 is formed with a larger size than thesecond module hole MH2. For example, the first module hole MH1 and thesecond module hole MH2 are relatively smaller in size than the firstarea AR1 and the second area AR2, respectively. Pixels PX for providingan image may not be located in the first and second areas AR1 and AR2.Therefore, the first and second areas AR1 and AR2 of the base layer BSmay be defined as non-display areas in the display panel 210. The pixelsPX may be located on the third area AR3 of the base layer BS. Therefore,an area including the third area AR3 of the base layer BS may be definedas a display area. That is, the display area of the display panel 210corresponds to the third area AR3 of the base layer BS and thenon-display area of the display panel 210 corresponds to the first andsecond areas AR1 and AR2 of the base layer BS. Although a structure inwhich the first and second areas AR1 and AR2 are formed with the samesize is shown in FIG. 3A, in another embodiment of the presentdisclosure, the first and second areas AR1 and AR2 may have differentsizes.

According to an embodiment of the present disclosure, a non-display areasurrounded by the display area may be located on a plane. Thenon-display area may be an area overlapping the first and secondelectronic modules 501 and 502 (see FIG. 1B).

The plurality of signal wirings SNL1, SNL2, EVDL, and EVSL are connectedto the pixels PX to transmit electrical signals to the pixels PX. Amongthe signal wirings included in the display panel 210, a first signalwiring SNL1, a second signal wiring SNL2, a first driving voltage wiringEVDL, and a second driving voltage wiring EVSL are shown, for example.The first signal wiring SNL1 may be referred to as data wiring. Thefirst signal wiring SNL1 may be in plurality, and the first signalwirings SNL1 may be arranged along the first direction DR1. The secondsignal wiring SNL2 may include a scan wiring GL and a light emittingcontrol wiring ECL. The scan wiring GL and the light emitting controlwiring ECL may be arranged along the second direction DR2. However, thisarrangement is shown as an example, and the signal wirings SNL1, SNL2,EVDL, and EVSL may further include an initialization voltage wiring, andare not limited to any one embodiment.

In FIG. 3B, an equivalent circuit diagram of one pixel PX from among theplurality of pixels PX is enlarged and illustrated. FIG. 3B illustratesa pixel PX connected to the i-th scan wiring GLi and an i-th lightemitting control wiring ECLi.

The pixel PX may include a light emitting element ED and a pixel circuitCC. The pixel circuit CC may include a plurality of transistors T1 to T7and a capacitor CP. The pixel circuit CC controls the amount of currentflowing through the light emitting element ED in response to the datasignal (e.g., SNL1).

Each of the plurality of transistors TI to T7 may include an inputelectrode (or a source electrode), an output electrode (or a drainelectrode), and a control electrode (or a gate electrode). In thepresent disclosure, for convenience, either the input electrode or theoutput electrode may be referred to as a first electrode and the othermay be referred to as a second electrode.

The first electrode of the first transistor T1 is connected to the firstdriving voltage wiring EVDL through the fifth transistor T5, and thesecond electrode of the first transistor T1 is connected to the anodeelectrode of the light emitting element ED through the sixth transistorT6. The first transistor T1 may be referred to as a driving transistorin the present disclosure. The first driving voltage wiring EVDL mayreceive the first driving voltage ELVDD.

The first transistor T1 controls the amount of current flowing throughthe light emitting element ED in response to the voltage applied to thecontrol electrode of the first transistor T1.

The second transistor T2 is connected between the first signal wiringSNL1 and the first electrode of the first transistor T1. The controlelectrode of the second transistor T2 is connected to the i-th scanwiring GLi. The second transistor T2 is turned on when the i-th scansignal is applied to the i-th scan wiring GLi, thereby electricallyconnecting the first signal wiring SNL1 and the first electrode of thefirst transistor T1.

The third transistor T3 is connected between the second electrode of thefirst transistor T1 and the control electrode of the first transistorT1. The control electrode of the third transistor T3 is connected to thei-th scan wiring GLi. The third transistor T3 is turned on when the i-thscan signal is applied to the i-th scan wiring GLi, thereby electricallyconnecting the second electrode of the first transistor T1 and thecontrol electrode of the first transistor T1. Therefore, when the thirdtransistor T3 is turned on, the first transistor T1 is connected in adiode form (e.g., the first transistor T1 is diode connected).

The fourth transistor T4 is connected between a node ND and aninitialization power generation unit (not shown). The control electrodeof the fourth transistor T4 is connected to the (i−1)-th scan wiringGLi−1. The fourth transistor T4 is turned on when the (i−1)-th scansignal is applied to the (i−1)-th scan wiring GLi−1, thereby providingthe initialization voltage Vint to the node ND.

The fifth transistor T5 is connected between the first driving voltagewiring EVDL and the first electrode of the first transistor T1. Thecontrol electrode of the fifth transistor T5 is connected to the i-thlight emitting control wiring ECLi.

The sixth transistor T6 is connected between the second electrode of thefirst transistor T1 and the anode electrode of the light emittingelement ED. The control electrode of the sixth transistor T6 isconnected to an i-th light emitting control wiring ECLi.

The seventh transistor T7 is connected between the initialization powergeneration unit (not shown) and the anode electrode of the lightemitting element ED. The control electrode of the seventh transistor T7is connected to the (i+1)-th scan wiring GLi+1. The seventh transistorT7 is turned on when the (i+1)-th scan signal is applied to the (i+1)-thscan wiring GLi+1, thereby providing the initialization voltage Vint tothe anode electrode of the light emitting element ED.

The seventh transistor T7 may improve the black display capability ofthe pixel PX. For example, when the seventh transistor T7 is turned on,the parasitic capacitor (not shown) of the light emitting element ED isdischarged. Then, when the black luminance is realized, the lightemitting element ED does not emit light due to the leakage current fromthe first transistor T1, and thus the black display capability may beimproved.

In addition, although the control electrode of the seventh transistor T7is illustrated as being connected to the (i+1)-th scan wiring GLi+1 inFIG. 3B, the embodiments of the present disclosure are not limitedthereto. In another embodiment of the present disclosure, the controlelectrode of the seventh transistor T7 may be connected to the i-th scanwiring GLi or the (i−1)-th scan wiring GLi−1.

The cathode of the light emitting element ED is connected to the seconddriving voltage wiring EVSL. The second driving voltage wiring EVSLreceives the second driving voltage ELVSS. Here, the second drivingvoltage ELVSS has a lower voltage level than the first driving voltageELVDD.

In FIG. 3B, the p-channel metal oxide semiconductor (PMOS) transistorsare shown as an example, however, the present disclosure is not limitedthereto. In another embodiment of the present disclosure, the pixelcircuit CC may be composed of one or more n-channel MOS (NMOS)transistors. In another embodiment of the present disclosure, the pixelcircuit CC may include a combination of one or more NMOS and one or morePMOS transistors.

The capacitor CP is located between the first driving voltage wiringEVDL and the node ND. The capacitor CP stores a difference voltagebetween the first driving voltage EVDL and a voltage of the node ND. Thevoltage of the node ND is proportional to the data signal. When thefifth transistor T5 and the sixth transistor T6 are turned on accordingto the voltage stored in the capacitor CP, the amount of current flowingthrough the first transistor T1 may be determined. The equivalentcircuit of the pixel PX in the present disclosure is not limited to theequivalent circuit shown in FIG. 3B. In another embodiment of thepresent disclosure, the pixel PX may be implemented in various forms tocause the light emitting element ED to emit light.

Referring to FIG. 4 , the display panel 210 includes a base layer BS, acircuit element layer DP-CL, a light emitting element layer DP-EDL, anda thin film sealing layer TFE. In an embodiment, the base layer BS, thecircuit element layer DP-CL, the light emitting element layer DP-EDL,and the thin film sealing layer TFE may be sequentially stacked in thethird direction DR3.

The base layer BS may be a member that provides a base surface on whichthe circuit element layer DP-CL is located. The base layer BS may be aglass substrate, a metal substrate, a plastic substrate, or the like.However, the embodiment is not limited thereto, and the base layer BSmay be an inorganic layer, an organic layer or a composite layer.

A circuit element layer DP-CL is located on the base layer BS. Thecircuit element layer DP-CL may include a pixel circuit CC (e.g., seeFIG. 3B). That is, the circuit element layer DP-CL may includetransistors T1 to T7 (e.g., see FIG. 3B) and a capacitor CP (e.g., seeFIG. 3B). In FIG. 4 , only one transistor PX-TR (hereinafter referred toas a pixel transistor) is illustrated for convenience of description.Here, the pixel transistor PX-TR may be the first transistor T1described with reference to FIG. 3B.

The circuit element layer DP-CL further includes first to sixthinsulating layers 10, 20, 30, 40, 50, and 60 stacked sequentially on thebase layer BS in the third direction DR3. The first insulating layer 10is located on the base layer BS. The first insulating layer 10 mayinclude a barrier layer 11 and a buffer layer 12.

The barrier layer 11 may include an inorganic material. The barrierlayer 11 may prevent or substantially prevent oxygen or moisture flowingthrough the base layer BS from penetrating the pixels PX (see FIG. 3A).For example, the barrier layer 11 may provide protection to the pixelsPX from external oxygen or moisture flowing through the base layer BS.The buffer layer 12 may include an inorganic material. The buffer layer12 may provide a lower surface energy to the pixels PX than the baselayer BS so that the pixels PX are stably formed on the base layer BS.For example, the buffer layer 12 may provide structural stability to thepixels PX. In FIG. 4 , the barrier layer 11 and the buffer layer 12 areeach shown as a single layer. However, the barrier layer 11 and thebuffer layer 12 according to an embodiment of the present disclosure maybe provided in a plurality and may be stacked alternately with eachother. In another embodiment, at least one of the barrier layer 11 andthe buffer layer 12 may be provided in plurality or may be omitted.

The transistor PX-TR may be located on the first insulating layer 10.The transistor PX-TR includes a semiconductor pattern SP, a controlelectrode CE, an input electrode IE, and an output electrode OE. Thesemiconductor pattern SP is located on the first insulating layer 10.The semiconductor pattern SP may include a semiconductor material. Thecontrol electrode CE is spaced from the semiconductor pattern SP withthe second insulating layer 20 therebetween. For example, the secondinsulating layer 20 provides a separation between the control electrodeCE and the semiconductor pattern SP. The control electrode CE may beconnected to one electrode of the capacitor CP.

The input electrode IE and the output electrode OE are spaced from thecontrol electrode CE with the third insulating layer 30 and the fourthinsulating layer 40 therebetween. For example, the third insulatinglayer 30 and the fourth insulating layer 40 provide a separation betweenthe input electrode IE and the output electrode OE, and the controlelectrode CE. The input electrode IE and the output electrode OEpenetrates the second insulating layer 20, the third insulating layer30, and the fourth insulating layer 40 and are connected to one side andthe other side of the semiconductor pattern SP, respectively.

An upper electrode UE may be located between the third insulating layer30 and the fourth insulating layer 40. The upper electrode UE may beconnected to the other electrode of the capacitor CP.

The fifth insulating layer 50 is located on the fourth insulating layer40 to cover the input electrode IE and the output electrode OE. Thefourth insulating layer 40 may include an organic material and/or aninorganic material, and may have a single layer or a laminatedstructure.

A connection electrode CNE may be located on the fifth insulating layer50. The connection electrode CNE may be connected to the outputelectrode OE. The sixth insulating layer 60 may be located on theconnection electrode CNE.

The pixel transistor PX-TR according to an embodiment of the presentdisclosure may be formed in various structures, and is not limited tothe embodiment shown in FIG. 4 .

The light emitting element layer DP-EDL is located on the circuitelement layer DP-CL. The light emitting element layer DP-EDL may includea plurality of light emitting elements ED.

The light emitting element ED is located on the sixth insulating layer60. The light emitting element ED may include a first electrode E1, alight emitting layer EL, and a second electrode E2. The first electrodeE1 may penetrate the sixth insulating layer 60 to be electricallyconnected to the pixel transistor PX-TR through the connection electrodeCNE.

A seventh insulating layer 70 may be located on the sixth insulatinglayer 60. An opening part OP may be defined in the seventh insulatinglayer 70, and the opening part OP may expose at least a portion of thefirst electrode E1. The seventh insulating layer 70 may be a pixeldefining layer.

The light emitting layer EL may be located on the first electrode E1exposed by the opening part OP defined in the seventh insulating layer70. The light emitting layer EL may include a luminescent material. Forexample, the light emitting layer EL may be composed of at least one ofmaterials emitting red, green, or blue light. The light emitting layerEL may include a fluorescent material or a phosphorescent material. Thelight emitting layer EL may include an organic light emitting materialor an inorganic light emitting material. The light emitting layer EL mayemit light in response to a potential difference between the firstelectrode E1 and the second electrode E2.

The second electrode E2 may be located on the light emitting layer EL.The second electrode E2 may be provided commonly to a plurality ofpixels PX. In other words, the second electrode E2 may be a commonelectrode shared by the plurality of pixels. The second electrode E2 mayhave a shape corresponding to the active area AA (see FIG. 3A). Thesecond electrode E2 may be electrically connected to the second drivingvoltage wiring EVSL (see FIG. 3A) located in the peripheral area NAA(see FIG. 3A). The second driving voltage wiring EVSL may provide thesecond driving voltage ELVSS (see FIG. 3B) to the second electrode E2.Therefore, each light emitting element ED located in each of the pixelsPX may receive a common second driving voltage ELVSS through the secondelectrode E2.

The second electrode E2 may include a transmissive conductive materialor a semi-transparent conductive material. Accordingly, light generatedin (or emitted from) the light emitting layer EL may be emitted towardthe third direction DR3 through the second electrode E2. But, this isillustrated by way of example. Depending on the design, the lightemitting element ED according to an embodiment of the present disclosuremay be driven in the rear surface light-emission system in which thefirst electrode E1 includes a transparent or semi-transparent material,or may be driven in a double-sided light-emission system in which lightis emitted towards both front and rear surfaces (e.g., a dual emissiondisplay in which the light is emitted toward the third direction DR3 anda direction opposite to the third direction DR3), but is not limited toany one embodiment.

The thin film sealing layer TFE may be located on the light emittingelement layer DP-EDL to seal the light emitting element ED. The thinfilm sealing layer TFE may cover the entire active area AA. The thinfilm sealing layer TFE may cover some areas of the peripheral area NAA.

The thin film sealing layer TFE may include a first inorganic layer 81,an organic layer 82, and a second inorganic layer 83 sequentiallystacked along the third direction DR3. In this embodiment, each of thefirst inorganic layer 81, the organic layer 82, and the second inorganiclayer 83 is shown as a single layer. However, this is illustrativelyshown, and at least one of the first inorganic layer 81, the organiclayer 82, and the second inorganic layer 83 may be provided in pluralityor may be omitted, but is not limited to any one embodiment.

The first inorganic layer 81 may cover the second electrode E2. Thefirst inorganic layer 81 may prevent or reduce external moisture oroxygen from penetrating the light emitting element ED. For example, thefirst inorganic layer 81 may include silicon nitride, silicon oxide, ora combination thereof. The first inorganic layer 81 may be formedthrough a deposition process.

The organic layer 82 may be located on the first inorganic layer 81 andcontact the first inorganic layer 81. The organic layer 82 may provide aflat surface on the first inorganic layer 81. For example, the organiclayer 82 may provide a flat surface to the active area AA.

The curve formed on the upper surface of the first inorganic layer 81and the particles existing on the first inorganic layer 81 are coveredby the organic layer 82, such that this may prevent or reduce theinfluence of the surface state of the upper surface of the firstinorganic layer 81 on the structures formed on the organic layer 82.Further, the organic layer 82 may relieve the stress between thecontacting layers. The organic layer 82 may include an organic material,and may be formed through a solution process such as a spin coatingprocess, a slit coating process, or an ink jet process.

The second inorganic layer 83 is located on the organic layer 82 tocover the organic layer 82. The second inorganic layer 83 may be stablyformed on a relatively flat surface as compared to being located on thefirst inorganic layer 81. The second inorganic layer 83 seals moistureor the like emitted from the organic layer 82 to prevent or reduce itfrom being introduced into the outside. For example, the secondinorganic layer 83 protects the organic layer 82 from externalinterferences by sealing the organic layer 82. The second inorganiclayer 83 may include silicon nitride, silicon oxide, or a combinationthereof. The second inorganic layer 83 may be formed through adeposition process.

Referring again to FIG. 3A, the display panel 210 includes a connectionwiring part. The connection wiring part includes a plurality of sensingconnection wirings TCL1 to TCLn. The plurality of sensing connectionwirings TCL1 to TCLn are located in the peripheral area NAA. On a plane(e.g., a plane extended along the first direction DR1 and the seconddirection DR2), the plurality of sensing connection wirings TCL1 to TCLnmay overlap the second driving power wiring EVSL. The plurality ofsensing connection wirings TCL1 to TCLn may extend in the seconddirection DR2 and may be arranged along the first direction DR1.

The connection wiring part may further include first and second contactparts CTP1 and CTP2. The first contact part CTP1 is connected to one endof the plurality of sensing connection wirings TCL1 to TCLn and thesecond contact part CTP2 is connected to the other end of the pluralityof sensing connection wirings TCL1 to TCLn. The first contact part CTP1includes a plurality of first contact electrodes CTE1 to CTEn (e.g.,CTE) located at (e.g., extends from) one end of the plurality of sensingconnection wirings TCL1 to TCLn. The second contact part CTP2 includes aplurality of second contact electrodes CTO1 to CTOn located at the otherend (e.g., opposite end) of the plurality of sensing connection wiringsTCL1 to TCLn.

The connection wiring part may be electrically connected to the inputsensing unit 220. For example, the plurality of sensing connectionwirings TCL1 to TCLn may be in direct electrical contact with thesensing signal wiring part of the input sensing unit 220 through thefirst and second contact parts CTP1 and CTP2.

The display panel 210 may include a first pad PD1, a second pad PD2, anda third pad PD3 located in the peripheral area NAA. The first pad PD1may be provided in a plurality and connected to the first signal wiringsSNL1. The second pad PD2 may be electrically connected to the firstdriving voltage wiring EVDL, and the third pad PD3 may be electricallyconnected to the second driving voltage wiring EVSL. The display panel210 may provide electrical signals from the outside (e.g., an externalsource) to the pixels PX through the first to third pads PD1 to PD3. Insome embodiments, the display panel 210 may further include pads forreceiving electrical signals other than the first to third pads PD1 toPD3, and are not limited to the embodiments shown in the currentfigures.

FIG. 5 is a plan view of an input sensing unit according to anembodiment of the present disclosure, and FIG. 6 is an enlarged planview of an area A1 shown in FIG. 5 . FIG. 7 is a cross-sectional viewtaken along the line I-I′ of FIG. 6 . FIG. 8 is a cross-sectional viewtaken along the line II-II′ of FIG. 6 . FIG. 9 is a cross-sectional viewtaken along the line III-III′ of FIG. 6 .

Referring to FIGS. 5 and 6 , the input sensing unit 220 may be locatedon the display panel 210 (shown in FIG. 3A). The input sensing unit 220is formed by a continuous process after forming the display panel 210.Thus, the input sensing unit 220 may be referred to as an input sensinglayer.

The input sensing unit 220 includes a first sensing electrode TE1, asecond sensing electrode TE2, sensing signal wiring parts RSL, TSL1, andTSL2, and sensing pad parts RPD, TPD1, and TPD2.

The first sensing electrode TE1 and the second sensing electrode TE2 arelocated in the active area AA. The input sensing unit 220 may obtaininformation on (e.g., regarding) the external input TC (see FIG. 1A)through a change in capacitance between the first sensing electrode TE1and the second sensing electrode TE2.

The first sensing electrode TE1 may include a plurality of first sensingpatterns SP1 and a plurality of first connection patterns BP1. At leastone first connection pattern BP1 may be connected to two first sensingpatterns SP1 adjacent to each other. For example, the first sensingpatterns SP1 are arranged along the first and second directions DR1 andDR2, and the first connection patterns BP1 connect at least two firstsensing patterns SP1 adjacent to each other in the first direction DR1.

The second sensing electrode TE2 may include a plurality of secondsensing patterns SP2 and a plurality of second connection patterns BP2.At least one second connection pattern BP2 may be connected to twosecond sensing patterns SP2 adjacent to each other. For example, thesecond sensing patterns SP2 are arranged along the first and seconddirections DR1 and DR2, and the second connection patterns BP2 connectat least two second sensing patterns SP2 adjacent to each other in thesecond direction DR2.

The sensing signal wiring parts RSL, TSL1, and TSL2 are located in theperipheral area NAA. The sensing signal wiring parts RSL, TSL1, and TSL2may include a reception wiring part RSL, a first transmission wiringpart TSL1, and a second transmission wiring part TSL2.

The reception wiring part RSL is connected to the first sensingelectrode TE1. The first and second transmission wiring parts TSL1 andTSL2 are connected to the second sensing electrode TE2. For example, thefirst transmission wiring part TSL1 is connected to one end of thesecond sensing electrode TE2, and the second transmission wiring partTSL2 is connected to the other end (e.g., opposite end) of the secondsensing electrode TE2. The other end of the second sensing electrode TE2may be a portion opposite to one end of the second sensing electrodeTE2.

According to the embodiments of the present disclosure, the secondsensing electrode TE2 has a relatively long length as compared to thefirst sensing electrode TE1 in the second direction DR2. That is, thefirst sensing electrode TE1 includes m first sensing pattern SP1 groupsarranged along the second direction DR2, and n first sensing patternsSP1 are connected to each other and located in the first direction DR1in each first sensing pattern SP1 group. In some embodiments, the secondsensing electrode TE2 includes n second sensing pattern SP2 groupsarranged along the first direction DR1, and m second sensing patternsSP2 are connected to each other and located in the second direction DR2in each second sensing pattern SP2 group. In case that the input sensingunit 220 has a portrait shape in which sides along the second directionDR2 is greater than sides along the first direction DR1, n and m may beintegers greater than 1, m may be a number greater than n. In this case,the length of each second sensing pattern SP2 group may be longer thanthe length of the first sensing pattern SP1 group. Therefore, byconnecting both ends of the second sensing electrode TE2 to the firstand second transmission wiring parts TSL1 and TSL2, the sensitivityaccording to the position of the second sensing electrode TE2 may bemaintained uniformly.

According to some embodiments of the present disclosure, the firsttransmission wiring part TSL1 includes a plurality of one side (e.g., afirst side) transmission wirings TSL1-1 to TSL1-n respectively connectedto one side of the n second sensing pattern groups. The secondtransmission wiring part TSL2 includes a plurality of other side (e.g.,a second side) transmission wirings TSL2-1 to TSL2-n connected to theother side of the n second sensing pattern groups.

The second transmission wiring part TSL2 further includes first andsecond sensing contact parts TCP1 and TCP2 extending from the pluralityof other side (e.g., the second side) transmission wirings TSL2-1 toTSL2-n. As an example of the present disclosure, the first sensingcontact part TCP1 is located adjacent to one end of the second sensingelectrode TE2, and the second sensing contact part TCP2 is locatedadjacent to the other end of the second sensing electrode TE2. The firstand second transmission wiring parts TSL1 and TSL2 are located in theperipheral area NAA, and for example, the first and second transmissionwiring parts TSL1 and TSL2 may be formed in an area (hereinafter,referred to as a thin film sealing area TFEA) where a thin film sealinglayer TFE (shown in FIG. 4 ) is located. The first and second sensingcontact parts TCP1 and TCP2 may be located in the peripheral area NAA,and for example, may be located outside the thin film sealing area TFEA.

The first sensing contact part TCP1 includes a plurality of firstsensing contact electrodes TCE1 to TCEn at one side of the plurality ofother side transmission wirings TSL2-1 to TSL2-n. The second sensingcontact part TCP2 includes a plurality of second sensing contactelectrodes TCO1 to TCOn located at the other side (e.g., opposite side)of the plurality of other transmission wirings TSL2-1 to TSL2-n.

The first and second sensing contact parts TCP1 and TCP2 may be locatedat positions corresponding to the first and second contact parts CTP1and CTP2 (e.g., see FIG. 3A) of the display panel 210. The first andsecond sensing contact parts TCP1 and TCP2 may directly contact thefirst and second contact parts CTP1 and CTP2, respectively. For example,the plurality of first sensing contact electrodes TCE1 to TCEn are incontact with the plurality of first contact electrodes CTE1 to CTEn,respectively, and the plurality of second sensing contact electrodesTCO1 to TCOn are in contact with the plurality of second contactelectrodes CTO1 to CTOn, respectively.

The sensing pad parts RPD, TPD1, and TPD2 are located in the peripheralarea NAA. In some embodiments, the sensing pad parts RPD, TPD1, and TPD2may include a plurality of reception pads RPD, a plurality of firsttransmission pads TPD1, and a plurality of second transmission padsTPD2. The plurality of reception pads RPD are connected to the receptionwiring part and electrically connected to the first sensing electrodeTE1. The plurality of first transmission pads TPD1 are connected to thefirst transmission wiring part TSL1, and the plurality of secondtransmission pads TPD2 are connected to the second transmission wiringpart TSL2. Therefore, the first transmission pad TPD1 and the secondtransmission pad TPD2 may be electrically connected to the secondsensing electrode TE2.

In some embodiments, some of the components of the input sensing unit220 may be removed or omitted from an area corresponding to the sensorareas SA1 and SA2. For example, at least some of the portion of thefirst sensing electrode TE1 and the portion of the second sensingelectrode TE2 may not be located in the sensor areas SA1 and SA2. In oneembodiment, the first sensing electrode TE1 may overlap the sensor areasSA1 and SA2 and may include the first sensing pattern SP1 having aportion removed, and the second sensing electrode TE2 may include thesecond sensing pattern SP2 having a portion removed. For example, thesensor areas SA1 and SA2 may have the first sensing pattern SP1 and thesecond sensing pattern SP2 at least partially removed.

According to the embodiments of the present disclosure, by removing aportion of the sensing electrodes TE1 and TE2 at the area overlappingthe sensor areas SA1 and SA2, the problem that the electronic modules500 (see FIG. 1B) are covered by (e.g., hidden behind) the first sensingelectrode TE1 or the second sensing electrode TE2 may be prevented orsubstantially prevented. Therefore, the sensitivity (e.g., sensingsensitivity) of the electronic modules 500 may be improved.

Referring to FIGS. 6 and 7 , a stacked structure of a circuit elementlayer DP-CL, a light emitting element layer DP-EDL, and a thin filmsealing layer TFE located in the active area AA has the sameconfiguration as that described with reference to FIG. 4 and thus, thedetailed description thereof will be omitted.

The circuit element layer DP-CL may include a driving circuit GDC fordriving the pixel circuit. The driving circuit GDC is located in theperipheral area NAA. The driving circuit GDC includes at least onetransistor GDC-TR formed through the same process as the pixeltransistors PX-TR in the active area AA. The driving circuit GDC mayinclude control signal lines GDC-SL located on the same layer as theinput electrode IE of the pixel transistor PX-TR. Although notseparately illustrated, the driving circuit GDC may further includecontrol signal lines located on the same layer as the control electrodeCE of the pixel transistor PX-TR.

The second driving voltage wiring EVSL may be in the peripheral area NAAand located outside the driving circuit GDC. The second driving voltagewiring EVSL may be located on the same layer as the connection electrodeCNE of the pixel transistor PX-TR. The second driving voltage wiringEVSL may receive the second driving voltage ELVSS from the outside.

The plurality of sensing connection wirings TCL1 to TCL4 are located inthe peripheral area NAA. The plurality of sensing connection wiringsTCL1 to TCL4 may be located on the same layer as the input electrode IEof the pixel transistor PX-TR. The plurality of sensing connectionwirings TCL1 to TCL4 may be located below the second driving voltagewiring EVSL, and may be electrically separated from the second drivingvoltage wiring EVSL. For example, the plurality of sensing connectionwirings TCL1 to TCL4 may be electrically isolated from the seconddriving voltage wiring EVSL. On a plane (e.g., for example, in a planview of a plane expanded along the first direction DR1 and the seconddirection DR2), the plurality of sensing connection wirings TCL1 to TCL4may overlap the second driving power wiring EVSL.

Referring to FIGS. 6 and 7 , the input sensing unit 220 may include afirst conductive layer, a second conductive layer, a first wiring layer,a second wiring layer, a first touch insulating layer 91, and a secondtouch insulating layer 92. The first conductive layer is located on thedisplay panel 210. For example, the first conductive layer may be formedon a thin film sealing layer TFE. The first conductive layer may includeat least one of the first and second sensing patterns SP1 and SP2 andthe first and second connection patterns BP1 and BP2. As an example ofthe present disclosure, the first conductive layer may include thesecond connection pattern BP2. The first conductive layer is covered bythe first touch insulating layer 91.

The second conductive layer is located on the first touch insulatinglayer 91. The second conductive layer may include at least one of thefirst and second sensing patterns SP1 and SP2 and the first and secondconnection patterns BP1 and BP2. The second conductive layer may includethe first connection pattern BP1 and the first and second sensingpatterns SP1 and SP2. A contact hole for connecting the secondconnection pattern BP2 and the second sensing pattern SP2 may be in thefirst touch insulating layer 91.

The second conductive layer is covered by the second touch insulatinglayer 92. The first and second touch insulating layers 91 and 92 mayhave an insulating property, and may be optically transparent. The firstand second touch insulating layers 91 and 92 may include at least oneinorganic layer and/or an organic layer. For example, when the first andsecond touch insulating layers 91 and 92 include an organic layer, theductility of the input sensing unit 220 may be improved. When the firstand second touch insulating layers 91 and 92 include an inorganic layer,a thin input sensing unit 220 may be provided, and internal impactstrength may be improved. The first and second touch insulating layers91 and 92 according to an embodiment of the present disclosure mayinclude various materials and are not limited to any one embodiment.

Each of the wirings of the sensing signal wiring parts RSL, TSL1, andTSL2 (see FIG. 5 ) may have a double wiring structure. As shown in FIG.7 , each of the plurality of other side transmission wirings TSL2-1 toTSL2-4 of the second transmission wiring part TSL2 may include a firstwiring layer MTL1 and a second wiring layer MTL2. In FIG. 7 , as anexample of the present disclosure, only the second transmission wiringpart TSL2 is illustrated, but the wirings of the wiring parts RSL andTSL1 may also include the first wiring layer MTL1 and the second wiringlayer MTL2.

The first wiring layer MTL1 is located on the same layer as the firstconductive layer. That is, the first conductive layer and the firstwiring layer MTL1 are formed on the thin film sealing layer TFE throughthe same process, and the second conductive layer and the second wiringlayer MTL2 are formed on the first touch insulating layer 91 through thesame process.

The first wiring layer MTL1 may contact the corresponding second wiringlayer MTL2 through a second contact hole in the first touch insulatinglayer 91. A plurality of second contact holes may be in the first touchinsulating layer 91, and the plurality of second contact holes may bearranged at set or predetermined intervals along an extension directionof the corresponding wiring.

On a plane, the other side transmission wirings TSL2-1 to TSL2-4 of thesecond transmission wiring part TSL2 may overlap the plurality ofsensing connection wirings TCL1 to TCL4 and the second driving powerwiring EVSL. Each of the other side transmission wirings TSL2-1 toTSL2-4 may be electrically connected to a corresponding sensingconnection wiring among the plurality of sensing connection wirings TCL1to TCL4. Especially, by the first and second contact parts CTP1 and CTP2contacted with the first and second sensing contact parts TCP1 and TCP2,the second transmission wiring part TSL2 may be electrically connectedto (e.g., contacts) the connection wiring part.

As shown in FIG. 6 , the plurality of second contact electrodes CTO1 toCTO4 located on the second contact part CTP2 are in direct contact withthe plurality of second sensing contact electrodes TCO1 to TCO4 locatedon the second sensing contact part TCP2, respectively.

Referring to FIG. 8 , a fourth other side transmission wiring TSL2-4among the other side transmission wirings TSL2-1 to TSL2-4 may includethe first wiring layer MTL1 and the second wiring layer MTL2. An areawhere the fourth other transmission wiring TSL2-4 crosses the other sidetransmission lines TSL2-1 to TSL2-3 may be defined as a crossing areaCA, and an area that does not cross the other transmission lines TSL2-1to TSL2-3 may be defined as a non-crossing area NCA.

In the non-crossing area NCA, the fourth other side transmission wiringTSL2-4 has a double layer structure in which the first and second wiringlayers MTL1 and MTL2 are arranged side by side (e.g., or on top of eachother in a stack structure, for example, the second wiring layer MTL2may be stacked on the first wiring layers MTL1). In the crossing areaCA, the fourth other side transmission wiring TSL2-4 may have a singlelayer structure including only one wiring layer (e.g., MTL1) of thefirst and second wiring layers MTL1 and MTL2. For example, in thecrossing area CA, the fourth other side transmission wiring TSL2-4 mayinclude only the first wiring layer MTL1. In the crossing area CA, thesecond wiring layer MTL2 of the fourth other side transmission wiringTSL2-4 may be removed or omitted.

First to third other side transmission wirings TSL2-1 to TSL2-3 amongthe other side transmission wirings TSL2-1 to TSL2-4 may have a singlelayer structure including only one wiring layer among the first andsecond wiring layers MTL1 and MTL2. Because the fourth other sidetransmission wiring TSL2-4 is composed of the first wiring layer MTL1 inthe intersection (e.g., crossing) area, the first to third other sidetransmission wirings TSL2-1 to TSL2-3 may be composed of the secondwiring layer MTL2 to avoid electrical contact with the fourth other sidetransmission wiring TSL2-4.

In the intersection (e.g., crossing) area CA, the arrangement structurebetween the other side transmission wirings TSL2-1 to TSL2-4 is notlimited to FIGS. 6 and 8 . That is, the arrangement structure of theother side transmission wirings TSL2-1 to TSL2-4 may be variouslymodified within a range in which they are not in electrical contact.

In FIG. 6 , for convenience, it is shown that the other sidetransmission wirings TSL2-1 to TSL2-4 do not overlap with thecorresponding sensing connection wirings TCL1 to TCL4 in the thin filmsealing area TFEA, but they may substantially overlap on a plane.

Referring to FIGS. 6 and 9 , each of the plurality of second sensingcontact electrodes TCO1 to TCO4 are located at one end of the other sidetransmission wirings TSL2-1 to TSL2-4, respectively. The plurality ofsecond sensing contact electrodes TCO1 to TCO4 overlap the plurality ofsecond contact electrodes CTO1 to CTO4, respectively. The plurality ofsecond sensing contact electrodes TCO1 to TCO4 contact the plurality ofsecond contact electrodes CTO1 to CTO4, respectively, through contactholes.

As shown in FIG. 9 , the second contact electrode CTO4 directly contactthe second sensing contact electrode TCO4. The second contact electrodeCTO4 may include first and second electrode layers CTL1 and CTL2. Thefirst electrode layer CTL1 is located on the same layer as the sensingconnection wirings TCL1 to TCL4 and located at one end of thecorresponding sensing connection wiring TCL1 to TCL4. The secondelectrode layer CTL2 is located on the same layer as the second drivingvoltage wiring EVSL and is at an upper part of the first electrode layerCTL1.

The second electrode layer CTL2 may be exposed through contact holes inthe sixth insulating layer 60, the first and second inorganic layers 81and 83, and the first touch insulating layer 91. Therefore, the secondsensing contact electrode TCO4 in the second contact part CTP2 maydirectly contact the second electrode layer CTL2 through the contacthole. The second sensing contact electrode TCO4 may be located on thesame layer as the second wiring layer MTL2. Thus, by the second contactelectrode CTO2 and the second sensing contact electrode TCO4, the fourthother side transmission wiring TSL2-4 may be electrically connected tothe corresponding sensing connection wiring TCL4.

Referring to FIG. 7 again, the display panel 210 may further includefirst and second dam parts DMP1 and DMP2 located in a peripheral areaNAA. As shown in FIG. 7 , the first and second dam parts DMP1 and DMP2may have a multilayer structure. The second dam part DMP2 may be locatedfarther outside than the first dam part DMP1. The first dam part DMP1includes a first lower dam DM1-L, a first intermediate dam DM1-M, and afirst upper dam DM1-U. The second dam part DMP2 includes a second lowerdam DM2-L, a second intermediate dam DM2-M, and a second upper damDM2-U.

The first and second lower dams DM1-L and DM2-L may be formedsimultaneously with the sixth insulating layer 60. The first and secondintermediate dams DM1-M and DM2-M are on the first and second lower damsDM1-L and DM2-L, respectively. The first and second intermediate damsDM1-M and DM2-M may be formed simultaneously with the seventh insulatinglayer 70. The first and second upper dams DM1-U and DM2-U are located onthe first and second intermediate dams DM1-M and DM2-M, respectively.The dummy insulating layer 75 formed simultaneously with the first andsecond upper dams DM1-U and DM2-U may be located on the seventhinsulating layer 70 in the active area.

The first and second dam parts DMP1 and DMP2 may be provided with aclosed loop shape in the peripheral area NAA to surround the active areaAA. Accordingly, the first and second dam parts DMP1 and DMP2 mayprevent or substantially prevent the liquid organic material in theactive area AA from spreading outward in the process of forming theorganic layer 82 of the thin film sealing layer TFE. For example, duringthe formation of the organic layer 82, the first and second dam partsDMP1 and DMP2 may prevent the liquid organic material from spilling. Theorganic layer 82 is formed by coating a liquid organic material on thefirst inorganic layer 81 through an inkjet method, and the first andsecond dam parts DMP1 and DMP2 may set a boundary of an area where aliquid organic material is located. The second dam part DMP2 may belocated farther outside from the active area AA than the first dam partDMP1.

The structure of the first and second dam parts DMP1 and DMP2 are notlimited to the embodiment of FIG. 7 . For example, the display panel 210may include only one dam part of the first and second dam parts DMP1 andDMP2. Also, although it is shown that each of the first and second damparts DMP1 and DMP2 has a triple film structure, each of the first andsecond dam parts DMP1 and DMP2 may have a double film structure.

The first inorganic layer 81 and the second inorganic layer 83 maycontact each other at the upper part (e.g., upper surface) of the firstand second dam parts DMP1 and DMP2. Because the organic layer 82 islocated inside the area defined by the first and second dam parts DMP1and DMP2, the first inorganic layer 81 and the second inorganic layer 83may contact each other on the first and second dam parts DMP1 and DMP2to seal the organic layer 82.

The first and second contact parts CTP1 and CTP2 are located outside thefirst and second dam parts DMP1 and DMP2 so that it is possible to forma contact structure for contacting the other side transmission wiringsTSL2-1 to TSL2-n of the second transmission wiring part TSL2 and theplurality of sensing connection wirings TCL1 to TCLn.

In some embodiments, by connecting the second transmission wiring partTSL2 to the plurality of sensing connection wirings TCL1 to TCL4 in thedisplay panel 210, the wiring resistance generated in the secondtransmission wiring part TSL2 may be reduced. The second transmissionwiring part TSL2 has a length longer than that of the first transmissionwiring part TSL1, thereby increasing the wiring resistance. When theline width of the second transmission wiring part TSL2 is increased toovercome the wiring resistance difference, the width of the peripheralarea NAA may increase, thereby increasing the bezel width of the displaydevice EA.

However, when the second transmission wiring part TSL2 is electricallyconnected to the plurality of sensing connection wirings TCL1 to TCL4 inthe display panel 210, the wiring resistance may be reduced withoutincreasing the line width of the second transmission wiring part TSL2.In addition, because the plurality of sensing connection wirings TCL1 toTCL4 are arranged in a structure overlapping with the second drivingvoltage wiring EVSL and the second transmission wiring part TSL2 on aplane, the bezel width is not increased by the plurality of sensingconnection wirings TCL1 to TCL4. Therefore, the wiring resistance of thesecond transmission wiring part TSL2 may be reduced without increasingthe bezel width.

FIG. 10 is a plan view of a display panel according to an embodiment ofthe present disclosure, and FIG. 11 is a plan view of an input sensingunit according to an embodiment of the present disclosure. FIG. 12 is anenlarged plan view of an area A2 shown in FIG. 11 , and FIG. 13 is across-sectional view taken along the line IV-IV′ shown in FIG. 12 .

Referring to FIG. 10 , in the display panel 215 according to anembodiment of the present disclosure, unlike the base layer BS shown inFIG. 3A, the base layer BS2 is not divided into the first to third areasAR1 to AR3. That is, the first and second module holes MH1 and MH2(shown in FIG. 3A) may not be in the base layer BS2.

The display panel 215 may include a connection wiring part in aperipheral area NAA. The connection wiring part includes a plurality ofsensing connection wirings TCL1 to TCLn. The plurality of sensingconnection wirings TCL1 to TCLn may extend in the second direction DR2and may be arranged along the first direction DR1. The plurality ofsensing connection wirings TCL1 to TCLn may be located further outsidethan the second driving voltage wiring EVSL.

The connection wiring part includes a first contact part CTP1 connectedto one end of the plurality of sensing connection wirings TCL1 to TCLnand a second contact part CTP2 connected to the other end of theplurality of sensing connection wirings TCL1 to TCLn. The first contactpart CTP1 includes a plurality of first contact electrodes CTE1 to CTEnlocated at one end of the plurality of sensing connection wirings TCL1to TCLn. The second contact part CTP2 includes a plurality of secondcontact electrodes CTO1 to CTOn located at the other end of theplurality of sensing connection wirings TCL1 to TCLn.

The connection wiring part may be electrically connected to the inputsensing unit 225. In particular, the plurality of sensing connectionwirings TCL1 to TCLn may electrically be in direct contact with thesensing signal wiring part of the input sensing unit 225 through thefirst and second contact parts CTP1 and CTP2.

Referring to FIG. 11 , in an embodiment of the present disclosure, thefirst transmission wiring part TSL1 includes a plurality of one sidetransmission wirings TSL1-1 to TSL1-n respectively connected to one sideof the n second sensing pattern groups. The second transmission wiringpart TSL2 includes a plurality of other side transmission wirings TSL2-1to TSL2-n connected to the other side of the n second sensing patterngroups. The second transmission wiring part TSL2 further includes firstand second sensing contact parts TCP1 and TCP2. The first sensingcontact part TCP1 includes a plurality of first sensing contactelectrodes TCE1 to TCEn extending from the plurality of secondtransmission pads TPD2. The second sensing contact part TCP2 includes aplurality of second sensing contact electrodes TCO1 to TCOn located atthe other side of the plurality of other transmission wirings TSL2-1 toTSL2-n.

As an example of the present disclosure, the first sensing contact partTCP1 is located adjacent to one end of the second sensing electrode TE2,and the second sensing contact part TCP2 is located adjacent to theother end of the second sensing electrode TE2. The first and secondtransmission wiring parts TSL1 and TSL2 are located in the peripheralarea NAA, and in particular, the first and second transmission wiringparts TSL1 and TSL2 may be located in an area TFEA where a thin filmsealing layer TFE (shown in FIG. 4 ) is formed. The first and secondsensing contact parts TCP1 and TCP2 may be located in the peripheralarea NAA, and for example, may be located outside the thin film sealingarea TFEA.

The first and second sensing contact parts TCP1 and TCP2 may be locatedat positions corresponding to the first and second contact parts CTP1and CTP2 (see FIG. 10 ) of the display panel 215. The first and secondsensing contact parts TCP1 and TCP2 may directly contact the first andsecond contact parts CTP1 and CTP2, respectively. For example, theplurality of first sensing contact electrodes TCE1 to TCEn are incontact with the plurality of first contact electrodes CTE1 to CTEn,respectively, and the plurality of second sensing contact electrodesTCO1 to TCOn are in contact with the plurality of second contactelectrodes CTO1 to CTOn, respectively.

As shown in FIG. 12 , on a plane, the plurality of sensing connectionwirings TCL1 to TCL4 may be located outside the first driving powerwiring EVSL. Each of the other side transmission wirings TSL2-1 toTSL2-4 may be electrically connected to a corresponding sensingconnection wiring among the plurality of sensing connection wirings TCL1to TCL4. Especially, by the first and second contact parts CTP1 and CTP2contacted with the first and second sensing contact parts TCP1 and TCP2,the second transmission wiring part TSL2 may be electrically connectedto the connection wiring part.

The plurality of second contact electrodes CTO1 to CTO4 formed on thesecond contact part CTP2 are in direct contact with the plurality ofsecond sensing contact electrodes TCO1 to TCO4 formed on the secondsensing contact part TCP2, respectively.

Referring to FIG. 13 , some wirings (e.g., the transmission wiringsTSL2-1 to TSL2-4 shown in FIG. 7 ) overlapping elements and wirings ofthe display panel 215 are removed or omitted on the thin film sealinglayer TFE in the peripheral area NAA. Therefore, coupling interferencebetween the sensing signal wiring part of the input sensing unit and theelements (or wirings) of the display panel may be reduced, and as aresult, the sensitivity degradation of the input sensing unit 225 due tothe electrical signal interference may be prevented or reduced.

The display device according to an embodiment of the present disclosureelectrically connects the sensing signal wiring part in the inputsensing unit to the connection wiring part in the display panel so thatthe wiring resistance of the sensing signal wiring part may be reduced.In addition, because the connection wiring part is located in astructure overlapping with the sensing signal wiring part on a plane, anincrease in the bezel width due to the connection wiring part may beprevented or reduced.

In addition, as some wirings of the sensing signal wiring part arelocated on the display panel, it is possible to prevent or reduce thesensitivity degradation due to electrical signal interference betweenthe display panel and the input sensing unit.

Although the embodiments of the present disclosure have been described,it is understood that the present disclosure should not be limited tothese embodiments but various changes and modifications may be made byone ordinary skilled in the art within the spirit and scope of thepresent disclosure as hereinafter claimed.

What is claimed is:
 1. A display device comprising: a base layer havingan active area and a peripheral area located outside the active area; acircuit element layer comprising a pixel circuit located in the activearea of the base layer and a driving voltage wiring located in theperipheral area of the base layer to supply a driving voltage to thepixel circuit; a light emitting element layer comprising a plurality oflight emitting elements on the circuit element layer; and an inputsensing layer on the light emitting element layer, the input sensinglayer comprising a sensing electrode and a sensing signal wiring partconnected to the sensing electrode, wherein the circuit element layercomprises a connection wiring part located on a same layer as andlaterally adjacent to the driving voltage wiring in the peripheral areaand being in contact with the sensing signal wiring part.
 2. The displaydevice of claim 1, wherein the sensing electrode comprises: a firstsensing electrode; and a second sensing electrode electrically insulatedfrom the first sensing electrode to form a capacitance.
 3. The displaydevice of claim 2, wherein the sensing signal wiring part comprises: areception wiring part connected to the first sensing electrode; and atransmission wiring part connected to the second sensing electrode,wherein the connection wiring part contacts the reception wiring part orthe transmission wiring part.
 4. The display device of claim 3, whereinthe transmission wiring part comprises: a first transmission wiring partconnected to one end of the second sensing electrode; and a secondtransmission wiring part connected to the other end of the secondsensing electrode, wherein the connection wiring part contacts thesecond transmission wiring part.
 5. The display device of claim 4,wherein the second transmission wiring part comprises: a plurality ofother side transmission wirings connected to the other end of the secondsensing electrode; a first sensing contact part located at one end ofthe plurality of other side transmission wirings; and a second sensingcontact part located at the other end of the plurality of other sidetransmission wirings.
 6. The display device of claim 5, wherein theconnection wiring part comprises: a plurality of sensing connectionwirings extending along the plurality of other side transmissionwirings; a first contact part connected to one end of the plurality ofsensing connection wirings to face the first sensing contact part; and asecond contact part connected to the other end of the plurality ofsensing connection wirings to face the second sensing contact part. 7.The display device of claim 6, wherein the first sensing contact partdirectly contacts the first contact part, and the second sensing contactpart directly contacts the second contact part.
 8. The display device ofclaim 6, wherein each of the plurality of other side transmissionwirings comprises: a first wiring layer on the light emitting elementlayer; and a second wiring layer located adjacent to the first wiringlayer with a touch insulating layer of the input sensing layerinterposed therebetween, wherein the first wiring layer and the secondwiring layer are electrically connected to each other.
 9. The displaydevice of claim 8, wherein each of the plurality of other sidetransmission wirings comprises one of the first wiring layer and thesecond wiring layer in a crossing area where the plurality of other sidetransmission wirings cross.
 10. The display device of claim 1, whereinthe pixel circuit comprises: a pixel transistor comprising a controlelectrode, an output electrode, and an input electrode; and a connectionelectrode on the output electrode, wherein the light emitting elementlayer is electrically connected to the connection electrode.
 11. Thedisplay device of claim 10, wherein the driving voltage wiring and theconnection wiring part are located on the same layer as the connectionelectrode.
 12. The display device of claim 1, wherein the active areacomprises a non-display area having at least one hole and a display areasurrounding the non-display area, wherein the pixel circuit and thelight emitting element layer are located in the display area.
 13. Adisplay device comprising: a base layer having an active area and aperipheral area located outside the active area; a circuit element layercomprising a pixel circuit in the active area of the base layer and adriving voltage wiring in the peripheral area of the base layer tosupply a driving voltage to the pixel circuit; a light emitting elementlayer comprising light emitting elements on the circuit element layer; athin film sealing layer configured to cover the light emitting elementlayer; and an input sensing layer on the thin film sealing layer, theinput sensing layer comprising a sensing electrode and a sensing signalwiring part connected to the sensing electrode, wherein the circuitelement layer comprises a connection wiring part located on a same layeras and laterally adjacent to the driving voltage wiring in theperipheral area and being in contact with the sensing signal wiringpart.
 14. The display device of claim 13, wherein the sensing electrodecomprises: a first sensing electrode; and a second sensing electrodeelectrically insulated from the first sensing electrode to form acapacitance.
 15. The display device of claim 14, wherein the sensingsignal wiring part comprises: a reception wiring part connected to thefirst sensing electrode; and a transmission wiring part connected to thesecond sensing electrode, wherein the connection wiring part contactsthe reception wiring part or the transmission wiring part.
 16. Thedisplay device of claim 15, wherein the transmission wiring partcomprises: a first transmission wiring part connected to one end of thesecond sensing electrode; and a second transmission wiring partconnected to the other end of the second sensing electrode, wherein theconnection wiring part contacts the second transmission wiring part. 17.The display device of claim 16, wherein the second transmission wiringpart comprises: a plurality of other side transmission wirings connectedto the other end of the second sensing electrode; a first sensingcontact part located at one end of the plurality of other sidetransmission wirings; and a second sensing contact part located at theother end of the plurality of other side transmission wirings.
 18. Thedisplay device of claim 17, wherein the connection wiring partcomprises: a plurality of sensing connection wirings extending along theplurality of other side transmission wirings; a first contact partconnected to one end of the plurality of sensing connection wirings toface the first sensing contact part; and a second contact part connectedto the other end of the plurality of sensing connection wirings to facethe second sensing contact part.
 19. The display device of claim 18,wherein the pixel circuit comprises a pixel transistor including acontrol electrode, an output electrode, and an input electrode, whereinthe light emitting element layer is electrically connected to the outputelectrode, wherein the driving voltage wiring and the plurality of otherside transmission wirings are located on the same layer as the input andoutput electrodes.
 20. The display device of claim 13, wherein the pixelcircuit comprises: a pixel transistor comprising a control electrode, anoutput electrode, and an input electrode; and a connection electrode onthe output electrode, wherein the light emitting element layer iselectrically connected to the connection electrode, the driving voltagewiring and the connection wiring part are located on the same layer asthe connection electrode.